KAYA-Y250BE

High-performance SMT equipment

Wave soldering

KAYA-Y250BE

Wave soldering machines with dual-zone preheating for small-batch to medium-scale lead-free through-hole PCB soldering

Suitable for small-batch to medium-scale lead-free through-hole PCB soldering, consumer/industrial electronics production, R&D and prototyping; efficient, stable core soldering configuration; precise, reliable dual-zone preheating and temperature control; durable, easy-to-maintain design; flexible production capacity

The KEYAN-Y series BE wave soldering machines with dual-zone preheating are Keyan's entry-level equipment for small-batch to medium-scale lead-free through-hole PCB soldering. The dual-zone infrared/hot-air preheating system operates from room temperature~230°C with an accuracy of ±5°C, activating flux and preheating PCBs to reduce thermal shock during soldering and improve soldering quality. The soldering system uses a patented clog-free nozzle/ST-6 nozzle together with an ST-6 lumina atomizing nozzle for fine, uniform flux application. Flux flow is adjustable from 10~100mL/min and needle valve pressure from 0.2MPa~0.5MPa. Pneumatic full-board spraying is standard and selective spraying is optional. The corrosion-resistant, durable solder pot is made of 316 stainless steel+cast iron+titanium, with model-dependent capacities of 150kg to 280kg and a maximum allowable temperature of 300°C. Wave height uses stepless variable-frequency speed control, adjustable over 0~15mm as standard or 15~20mm as an option to accommodate different board thicknesses and component heights. The conveyor uses single-hook/double-hook titanium fingers as standard, with optional heavy-duty double-hook fingers for PCBs of different weights and sizes. The touch screen+PLC (HMI+PLC) control architecture is easy to operate and maintain. Cooling uses forced air, with a required exhaust flow of 15m³/min ×2 channels and exhaust outlet diameter of Φ200mm. Typical small-batch through-hole soldering applications include consumer electronics power supply boards, small appliance control boards, LED lighting driver boards and industrial sensor modules.

ENGINEERING DATA

Technical specifications

KAYA-Y250BE

Model KAYA-Y250BE
Model KAYA-Y250BE
Application Wave soldering
KAYA-Y250BE Technical specifications
Item Value
Machine dimensions 2800*1200*1650mm
Power supply AC 380V, 50/60Hz, 3P5W, 30A
Nozzle Patented clog-free nozzle/ST-6 nozzle
Operating power 4kW
Control system Touch screen+PLC (HMI+PLC)
Preheating temperature control accuracy ±5°C
Needle valve pressure 0.2MPa~0.5MPa
Spray mode Pneumatic full-board spraying (standard); pneumatic selective spraying
Flux flow rate 10~100mL/min
Preheating method Infrared/hot-air heating
Number of preheating zones 2
Preheating temperature range Room temperature~230°C
Temperature control mode PID+SSR
Solder pot material 316 stainless steel+cast iron+titanium
Solder pot capacity (solder specific gravity 7-5) 180kg
Maximum allowable solder pot temperature 300°C
Wave height adjustment Stepless variable-frequency speed control
Wave height 0~15mm (standard); 15~20mm (optional)
PCB conveyor entry height 750±20mm
PCB width range 50~250mm
PCB component clearance Above board 120mm/below board 25mm
PCB conveyor speed 0~1800mm/min
Conveyor fingers Single-hook/double-hook titanium fingers (standard); heavy-duty double-hook titanium fingers (optional)
Speed control method Closed-loop stepless variable-frequency speed control
Cooling method Forced-air cooling
Weight 400kg
Required exhaust flow 15m³/min×2 channels; exhaust outlet diameter: Φ200mm; forced-air cooling
APPLICATION CONTEXT

Applications

Suitable for small-batch to medium-scale lead-free through-hole PCB soldering, consumer/industrial electronics production, R&D and prototyping; efficient, stable core soldering configuration; precise, reliable dual-zone preheating and temperature control; durable, easy-to-maintain design; flexible production capacity
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