The KEYAN-Y series BE wave soldering machines with dual-zone preheating are Keyan's entry-level equipment for small-batch to medium-scale lead-free through-hole PCB soldering. The dual-zone infrared/hot-air preheating system operates from room temperature~230°C with an accuracy of ±5°C, activating flux and preheating PCBs to reduce thermal shock during soldering and improve soldering quality. The soldering system uses a patented clog-free nozzle/ST-6 nozzle together with an ST-6 lumina atomizing nozzle for fine, uniform flux application. Flux flow is adjustable from 10~100mL/min and needle valve pressure from 0.2MPa~0.5MPa. Pneumatic full-board spraying is standard and selective spraying is optional. The corrosion-resistant, durable solder pot is made of 316 stainless steel+cast iron+titanium, with model-dependent capacities of 150kg to 280kg and a maximum allowable temperature of 300°C. Wave height uses stepless variable-frequency speed control, adjustable over 0~15mm as standard or 15~20mm as an option to accommodate different board thicknesses and component heights. The conveyor uses single-hook/double-hook titanium fingers as standard, with optional heavy-duty double-hook fingers for PCBs of different weights and sizes. The touch screen+PLC (HMI+PLC) control architecture is easy to operate and maintain. Cooling uses forced air, with a required exhaust flow of 15m³/min ×2 channels and exhaust outlet diameter of Φ200mm. Typical small-batch through-hole soldering applications include consumer electronics power supply boards, small appliance control boards, LED lighting driver boards and industrial sensor modules.
KAYA-Y250BE
High-performance SMT equipment
Wave soldering
KAYA-Y250BE
Wave soldering machines with dual-zone preheating for small-batch to medium-scale lead-free through-hole PCB soldering
Suitable for small-batch to medium-scale lead-free through-hole PCB soldering, consumer/industrial electronics production, R&D and prototyping; efficient, stable core soldering configuration; precise, reliable dual-zone preheating and temperature control; durable, easy-to-maintain design; flexible production capacity
ENGINEERING DATA
Technical specifications
KAYA-Y250BE
Model
KAYA-Y250BE
Model
KAYA-Y250BE
Application
Wave soldering
| Item | Value |
|---|---|
| Machine dimensions | 2800*1200*1650mm |
| Power supply | AC 380V, 50/60Hz, 3P5W, 30A |
| Nozzle | Patented clog-free nozzle/ST-6 nozzle |
| Operating power | 4kW |
| Control system | Touch screen+PLC (HMI+PLC) |
| Preheating temperature control accuracy | ±5°C |
| Needle valve pressure | 0.2MPa~0.5MPa |
| Spray mode | Pneumatic full-board spraying (standard); pneumatic selective spraying |
| Flux flow rate | 10~100mL/min |
| Preheating method | Infrared/hot-air heating |
| Number of preheating zones | 2 |
| Preheating temperature range | Room temperature~230°C |
| Temperature control mode | PID+SSR |
| Solder pot material | 316 stainless steel+cast iron+titanium |
| Solder pot capacity (solder specific gravity 7-5) | 180kg |
| Maximum allowable solder pot temperature | 300°C |
| Wave height adjustment | Stepless variable-frequency speed control |
| Wave height | 0~15mm (standard); 15~20mm (optional) |
| PCB conveyor entry height | 750±20mm |
| PCB width range | 50~250mm |
| PCB component clearance | Above board 120mm/below board 25mm |
| PCB conveyor speed | 0~1800mm/min |
| Conveyor fingers | Single-hook/double-hook titanium fingers (standard); heavy-duty double-hook titanium fingers (optional) |
| Speed control method | Closed-loop stepless variable-frequency speed control |
| Cooling method | Forced-air cooling |
| Weight | 400kg |
| Required exhaust flow | 15m³/min×2 channels; exhaust outlet diameter: Φ200mm; forced-air cooling |
APPLICATION CONTEXT
Applications
Suitable for small-batch to medium-scale lead-free through-hole PCB soldering, consumer/industrial electronics production, R&D and prototyping; efficient, stable core soldering configuration; precise, reliable dual-zone preheating and temperature control; durable, easy-to-maintain design; flexible production capacity
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