Solder paste printers

KEYAN-K8

The KEYAN-K8 is a flagship product in Keyan's solder paste printer range and its best-selling mainstay model, designed for mass production of consumer electronics such as smartphones and tablets. The K8 balances precision and speed: vision alignment repeatability is ±0.01mm, printing repeatability is ±0.025mm, and the printing cycle time is ＜8sec/P, combining high accuracy with fast throughput to meet demanding consumer electronics production requirements. The printing system uses electrically driven squeegees, unlike the pneumatic drive on the K3/K6, with finely adjustable squeegee pressure of 1~10kg and stencil separation speed of 0~10mm/S for fine-pitch, high-density PCBs. Stencil cleaning is upgraded to three methods, dry, wet and vacuum, which can be combined to suit different solder pastes and PCB processes and reduce printing defects caused by clogged stencils. Core inline connectivity allows integration with an SMT line MES for production data traceability and process parameter management. The K8 features a modern black-and-red design and optimized structural rigidity to minimize vibration during high-speed operation and maintain excellent accuracy. Typical applications include high-volume consumer electronics SMT lines for smartphone motherboards, tablet PCBAs, wearable device boards and laptop motherboards.

KAYA-K6

A stable, reliable all-rounder for high-reliability products

KEYAN-K12

The KEYAN-K12 is Keyan's dedicated large-format solder paste printer for high-density, large PCBs used in high-end communications equipment and server motherboards. Supporting PCB sizes up to 1200×400mm, the K12 is one of the few printers in the industry capable of handling oversized backplanes. It matches the K8's vision alignment repeatability of ±0.01mm and printing repeatability of ±0.025mm, maintaining print consistency across the entire large board. This is critical for high-density interconnect products such as server motherboards and communications backplanes. The machine provides a printing stroke of up to 1200mm and fine squeegee pressure adjustment over 1~10kg. It accepts large stencil frames from 680×355mm to 1480×680mm. The PCB support system uses automatically controlled flexible clamping and support, with optional vacuum board holding to prevent large, thin boards from deforming or lifting during printing. Overall dimensions are L=2200*W=1200*H=1500mm and weight is 2000kg. A reinforced steel structure maintains stability during long-stroke printing. The K12 also offers optional adhesive dispensing, automatic solder paste replenishment, remaining solder paste detection and 3D solder paste inspection (SPI) to support the complete process requirements of high-end manufacturing. Typical applications include SMT production lines for large, highly reliable PCBs such as communications base station boards, server motherboards, data center switch backplanes and new energy vehicle controllers.

KAYA-K3

A precision paste-application specialist: ensuring uniform solder paste distribution and a sound foundation for soldering