Wave soldering
High-end SMT equipment solutions
Product categories
KEYAN-Y600BP
The KEYAN-Y series of large industrial wave soldering machines is Keyan's flagship range for high-volume production. It handles PCB widths of 50~600mm and supports infrared/hot-air preheating, meeting high-throughput, high-reliability through-hole soldering needs from small batches to mass production. The series comprises BP350, BP450 and BP600 models, with supported PCB widths increasing from 50~350mm to 50~600mm. Customers can select the model that best matches their board dimensions and capacity requirements. The upgraded 4-stage preheating system provides more thorough, uniform heating, accommodates differences in thermal mass between large and multilayer PCBs, and maintains consistent soldering temperature profiles. Solder pot capacity is significantly increased: approximately 380kg for BP350, 450kg for BP450 and 700kg for BP600. The larger pots accommodate wider PCBs and more through-hole components. Wave pump power is also upgraded: 1/4 HPX2 3P 220VAC for BP350 and 1/2 HPX2 3P 220VAC for BP450/BP600. The stronger, more stable waves support through-hole fill and solder joint quality on large PCBs. The conveyor uses single-hook/double-hook titanium fingers as standard, with heavy-duty double-hook fingers available as an option for heavy PCBs. All models use WIN10+industrial PC+PLC, supporting one-touch recall of process parameters, efficient changeovers and full-process data traceability. Weighing 800kg to 1000kg, the robust machines are designed for continuous 24-hour mass production. Typical applications include through-hole soldering for large, high-power products such as new energy vehicle power management units, industrial variable-frequency drives, large power supplies, communications cabinet power supplies and LED display power supplies.
KEYAN-Y450BP
Industrial-grade large-format wave soldering machines with flexible capacity for wide PCBs and efficient, uniform multi-stage preheating
KEYAN-Y300BP
The KEYAN-Y series BP wave soldering machines with three-stage preheating are an upgrade of the BE models. They retain the core advantages of the BE models while upgrading preheating to three stages and the control system from touch screen+PLC to WIN10+industrial PC+PLC, substantially improving automation and process control. Combined infrared/hot-air heating produces smoother, more precise preheating temperature profiles to accommodate complex PCBs and different components, reduce soldering defects and improve yield. The BP models combine powerful, uniform three-stage preheating with precise PID+SSR temperature control. The preheating range is room temperature~230°C, with an accuracy of ±5°C. The soldering system remains the same as the BE models: a patented clog-free nozzle/ST-6 nozzle, ST-6 lumina atomizing nozzle, adjustable flux flow of 10~100mL/min and needle valve pressure of 0.2MPa~0.5MPa, with pneumatic full-board spraying as standard and selective spraying as an option. The solder pot is also made of cast iron+titanium, with a capacity of 150kg~280kg and a maximum allowable temperature of 300°C. Wave height is adjusted by stepless variable-frequency speed control, with 0~15mm as standard and 15~20mm as an option. The conveyor uses single-hook/double-hook titanium fingers as standard, with heavy-duty double-hook fingers available as an option. The PCB width range is 50~300mm, with component clearance of 120mm above and 25mm below the board. The core BP upgrade is its intelligent WIN10+industrial PC+PLC system, which stores and recalls process parameters, enables efficient changeovers and provides full-process data traceability for digital factory management. Typical applications include medium-volume through-hole soldering for automotive electronic modules, industrial control equipment, power supplies and communications equipment, especially where soldering quality and process control requirements are demanding.
KAYA-Y250BP
The KEYAN-Y series BP wave soldering machines with three-stage preheating are an upgrade of the BE models. They retain the core advantages of the BE models while upgrading preheating to three stages and the control system from touch screen+PLC to WIN10+industrial PC+PLC, substantially improving automation and process control. Combined infrared/hot-air heating produces smoother, more precise preheating temperature profiles to accommodate complex PCBs and different components, reduce soldering defects and improve yield. The BP models combine powerful, uniform three-stage preheating with precise PID+SSR temperature control. The preheating range is room temperature~230°C, with an accuracy of ±5°C. The soldering system remains the same as the BE models: a patented clog-free nozzle/ST-6 nozzle, ST-6 lumina atomizing nozzle, adjustable flux flow of 10~100mL/min and needle valve pressure of 0.2MPa~0.5MPa, with pneumatic full-board spraying as standard and selective spraying as an option. The solder pot is also made of cast iron+titanium, with a capacity of 150kg~280kg and a maximum allowable temperature of 300°C. Wave height is adjusted by stepless variable-frequency speed control, with 0~15mm as standard and 15~20mm as an option. The conveyor uses single-hook/double-hook titanium fingers as standard, with heavy-duty double-hook fingers available as an option. The PCB width range is 50~300mm, with component clearance of 120mm above and 25mm below the board. The core BP upgrade is its intelligent WIN10+industrial PC+PLC system, which stores and recalls process parameters, enables efficient changeovers and provides full-process data traceability for digital factory management. Typical applications include medium-volume through-hole soldering for automotive electronic modules, industrial control equipment, power supplies and communications equipment, especially where soldering quality and process control requirements are demanding.
KAYA-Y200BP
The KEYAN-Y series BP wave soldering machines with three-stage preheating are an upgrade of the BE models. They retain the core advantages of the BE models while upgrading preheating to three stages and the control system from touch screen+PLC to WIN10+industrial PC+PLC, substantially improving automation and process control. Combined infrared/hot-air heating produces smoother, more precise preheating temperature profiles to accommodate complex PCBs and different components, reduce soldering defects and improve yield. The BP models combine powerful, uniform three-stage preheating with precise PID+SSR temperature control. The preheating range is room temperature~230°C, with an accuracy of ±5°C. The soldering system remains the same as the BE models: a patented clog-free nozzle/ST-6 nozzle, ST-6 lumina atomizing nozzle, adjustable flux flow of 10~100mL/min and needle valve pressure of 0.2MPa~0.5MPa, with pneumatic full-board spraying as standard and selective spraying as an option. The solder pot is also made of 316 stainless steel+316 stainless steel+cast iron+titanium, with a capacity of 150kg~280kg and a maximum allowable temperature of 300°C. Wave height is adjusted by stepless variable-frequency speed control, with 0~15mm as standard and 15~20mm as an option. The conveyor uses single-hook/double-hook titanium fingers as standard, with heavy-duty double-hook fingers available as an option. The PCB width range is 50~300mm, with component clearance of 120mm above and 25mm below the board. The core BP upgrade is its intelligent WIN10+industrial PC+PLC system, which stores and recalls process parameters, enables efficient changeovers and provides full-process data traceability for digital factory management. Typical applications include medium-volume through-hole soldering for automotive electronic modules, industrial control equipment, power supplies and communications equipment, especially where soldering quality and process control requirements are demanding.
KEYAN-Y300BE
The KEYAN-Y series BE wave soldering machines with dual-zone preheating are Keyan's entry-level equipment for small-batch to medium-scale lead-free through-hole PCB soldering. The dual-zone infrared/hot-air preheating system operates from room temperature~230°C with an accuracy of ±5°C, activating flux and preheating PCBs to reduce thermal shock during soldering and improve soldering quality. The soldering system uses a patented clog-free nozzle/ST-6 nozzle together with an ST-6 lumina atomizing nozzle for fine, uniform flux application. Flux flow is adjustable from 10~100mL/min and needle valve pressure from 0.2MPa~0.5MPa. Pneumatic full-board spraying is standard and selective spraying is optional. The corrosion-resistant, durable solder pot is made of 316 stainless steel+cast iron+titanium, with model-dependent capacities of 150kg to 280kg and a maximum allowable temperature of 300°C. Wave height uses stepless variable-frequency speed control, adjustable over 0~15mm as standard or 15~20mm as an option to accommodate different board thicknesses and component heights. The conveyor uses single-hook/double-hook titanium fingers as standard, with optional heavy-duty double-hook fingers for PCBs of different weights and sizes. The touch screen+PLC (HMI+PLC) control architecture is easy to operate and maintain. Cooling uses forced air, with a required exhaust flow of 15m³/min ×2 channels and exhaust outlet diameter of Φ200mm. Typical small-batch through-hole soldering applications include consumer electronics power supply boards, small appliance control boards, LED lighting driver boards and industrial sensor modules.
KAYA-Y350BP
The KEYAN-Y series of large industrial wave soldering machines is Keyan's flagship range for high-volume production. It handles PCB widths of 50~600mm and supports infrared/hot-air preheating and soldering in a nitrogen atmosphere, meeting high-throughput, high-reliability through-hole soldering needs from small batches to mass production. The series comprises BP350, BP450 and BP600 models, with supported PCB widths increasing from 50~350mm to 50~600mm. Customers can select the model that best matches their board dimensions and capacity requirements. The upgraded 4-stage preheating system provides more thorough, uniform heating, accommodates differences in thermal mass between large and multilayer PCBs, and maintains consistent soldering temperature profiles. Solder pot capacity is significantly increased: approximately 380kg for BP350, 450kg for BP450 and 700kg for BP600. The larger pots accommodate wider PCBs and more through-hole components. Wave pump power is also upgraded: 1/4 HPX2 3P 220VAC for BP350 and 1/2 HPX2 3P 220VAC for BP450/BP600. The stronger, more stable waves support through-hole fill and solder joint quality on large PCBs. The conveyor uses single-hook/double-hook titanium fingers as standard, with heavy-duty double-hook fingers available as an option for heavy PCBs. All models use WIN10+industrial PC+PLC, supporting one-touch recall of process parameters, efficient changeovers and full-process data traceability. Weighing 800kg to 1000kg, the robust machines are designed for continuous 24-hour mass production. Typical applications include through-hole soldering for large, high-power products such as new energy vehicle power management units, industrial variable-frequency drives, large power supplies, communications cabinet power supplies and LED display power supplies.
KAYA-Y250BE
The KEYAN-Y series BE wave soldering machines with dual-zone preheating are Keyan's entry-level equipment for small-batch to medium-scale lead-free through-hole PCB soldering. The dual-zone infrared/hot-air preheating system operates from room temperature~230°C with an accuracy of ±5°C, activating flux and preheating PCBs to reduce thermal shock during soldering and improve soldering quality. The soldering system uses a patented clog-free nozzle/ST-6 nozzle together with an ST-6 lumina atomizing nozzle for fine, uniform flux application. Flux flow is adjustable from 10~100mL/min and needle valve pressure from 0.2MPa~0.5MPa. Pneumatic full-board spraying is standard and selective spraying is optional. The corrosion-resistant, durable solder pot is made of 316 stainless steel+cast iron+titanium, with model-dependent capacities of 150kg to 280kg and a maximum allowable temperature of 300°C. Wave height uses stepless variable-frequency speed control, adjustable over 0~15mm as standard or 15~20mm as an option to accommodate different board thicknesses and component heights. The conveyor uses single-hook/double-hook titanium fingers as standard, with optional heavy-duty double-hook fingers for PCBs of different weights and sizes. The touch screen+PLC (HMI+PLC) control architecture is easy to operate and maintain. Cooling uses forced air, with a required exhaust flow of 15m³/min ×2 channels and exhaust outlet diameter of Φ200mm. Typical small-batch through-hole soldering applications include consumer electronics power supply boards, small appliance control boards, LED lighting driver boards and industrial sensor modules.
KAYA-Y200BE
The KEYAN-Y series BE wave soldering machines with dual-zone preheating are Keyan's entry-level equipment for small-batch to medium-scale lead-free through-hole PCB soldering. The dual-zone infrared/hot-air preheating system operates from room temperature~230°C with an accuracy of ±5°C, activating flux and preheating PCBs to reduce thermal shock during soldering and improve soldering quality. The soldering system uses a patented clog-free nozzle/ST-6 nozzle together with an ST-6 lumina atomizing nozzle for fine, uniform flux application. Flux flow is adjustable from 10~100mL/min and needle valve pressure from 0.2MPa~0.5MPa. Pneumatic full-board spraying is standard and selective spraying is optional. The corrosion-resistant, durable solder pot is made of 316 stainless steel+cast iron+titanium, with model-dependent capacities of 150kg to 280kg and a maximum allowable temperature of 300°C. Wave height uses stepless variable-frequency speed control, adjustable over 0~15mm as standard or 15~20mm as an option to accommodate different board thicknesses and component heights. The conveyor uses single-hook/double-hook titanium fingers as standard, with optional heavy-duty double-hook fingers for PCBs of different weights and sizes. The touch screen+PLC (HMI+PLC) control architecture is easy to operate and maintain. Cooling uses forced air, with a required exhaust flow of 15m³/min ×2 channels and exhaust outlet diameter of Φ200mm. Typical small-batch through-hole soldering applications include consumer electronics power supply boards, small appliance control boards, LED lighting driver boards and industrial sensor modules.