The KEYAN-Y series of large industrial wave soldering machines is Keyan's flagship range for high-volume production. It handles PCB widths of 50~600mm and supports infrared/hot-air preheating and soldering in a nitrogen atmosphere, meeting high-throughput, high-reliability through-hole soldering needs from small batches to mass production. The series comprises BP350, BP450 and BP600 models, with supported PCB widths increasing from 50~350mm to 50~600mm. Customers can select the model that best matches their board dimensions and capacity requirements. The upgraded 4-stage preheating system provides more thorough, uniform heating, accommodates differences in thermal mass between large and multilayer PCBs, and maintains consistent soldering temperature profiles. Solder pot capacity is significantly increased: approximately 380kg for BP350, 450kg for BP450 and 700kg for BP600. The larger pots accommodate wider PCBs and more through-hole components. Wave pump power is also upgraded: 1/4 HPX2 3P 220VAC for BP350 and 1/2 HPX2 3P 220VAC for BP450/BP600. The stronger, more stable waves support through-hole fill and solder joint quality on large PCBs. The conveyor uses single-hook/double-hook titanium fingers as standard, with heavy-duty double-hook fingers available as an option for heavy PCBs. All models use WIN10+industrial PC+PLC, supporting one-touch recall of process parameters, efficient changeovers and full-process data traceability. Weighing 800kg to 1000kg, the robust machines are designed for continuous 24-hour mass production. Typical applications include through-hole soldering for large, high-power products such as new energy vehicle power management units, industrial variable-frequency drives, large power supplies, communications cabinet power supplies and LED display power supplies.
KEYAN-Y450BP
High-performance SMT equipment
Wave soldering
KEYAN-Y450BP
Industrial-grade large-format wave soldering machines with flexible capacity for wide PCBs and efficient, uniform multi-stage preheating
Handles PCB widths of 50~600mm with infrared/hot-air preheating and soldering in a nitrogen atmosphere; high-throughput, high-reliability through-hole soldering from small batches to mass production; flexible capacity for wide PCBs; efficient, uniform multi-stage preheating; stable, reliable industrial-grade soldering configuration; intelligent, easy-to-use control of the entire process
ENGINEERING DATA
Technical specifications
KEYAN-Y450BP
Model
KEYAN-Y450BP
Model
KEYAN-Y450BP
Application
Wave soldering
| Item | Value |
|---|---|
| Machine dimensions | 1200*1500*1650mm |
| Power supply | AC 380V, 50/60Hz, 3P5W, 25A |
| Nozzle | Patented clog-free nozzle/ST-6 spray |
| Operating power | 3kW |
| Control system | WIN10+industrial PC+PLC |
| Preheating temperature control accuracy | ±5°C |
| Needle valve pressure | 0.2MPa~0.5MPa |
| Spray mode | Pneumatic full-board spraying (standard); pneumatic selective spraying |
| Flux flow rate | 10~100mL/min |
| Flux nozzle | ST-6 lumina atomizing nozzle |
| Preheating method | Infrared/hot-air heating |
| Number of preheating zones | 4 |
| Preheating temperature range | Room temperature~230°C |
| Temperature control mode | PID+SSR |
| Solder pot material | 316 stainless steel+cast iron+titanium |
| Solder pot capacity (solder specific gravity 7.5) | 150kg |
| Maximum allowable solder pot temperature | Max. 300°C |
| Wave height adjustment | Stepless variable-frequency speed control |
| Wave height | 0~15mm (standard); 15~20mm (optional) |
| PCB conveyor entry height | 750±20mm |
| PCB width range | 50~200mm |
| PCB component clearance | Above board 120mm/below board 25mm |
| PCB conveyor speed | 0~1800mm/min |
| Conveyor fingers | Single-hook/double-hook titanium fingers (standard); heavy-duty double-hook titanium fingers (optional) |
| Speed control method | Closed-loop stepless variable-frequency speed control |
| Cooling method | Forced-air cooling |
| Weight | 300kg |
| Required exhaust flow | 15m³/min ×2 channels; exhaust outlet diameter: Φ200mm; cooling |
APPLICATION CONTEXT
Applications
Handles PCB widths of 50~600mm with infrared/hot-air preheating and soldering in a nitrogen atmosphere; high-throughput, high-reliability through-hole soldering from small batches to mass production; flexible capacity for wide PCBs; efficient, uniform multi-stage preheating; stable, reliable industrial-grade soldering configuration; intelligent, easy-to-use control of the entire process
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