KEYAN-Y600BP

High-performance SMT equipment

Wave soldering

KEYAN-Y600BP

Industrial-grade large-format wave soldering machines with flexible capacity for wide PCBs and efficient, uniform multi-stage preheating

Handles PCB widths of 50~600mm with infrared/hot-air preheating; high-throughput, high-reliability through-hole soldering from small batches to mass production; flexible capacity for wide PCBs; efficient, uniform multi-stage preheating; stable, reliable industrial-grade soldering configuration; intelligent, easy-to-use control of the entire process

The KEYAN-Y series of large industrial wave soldering machines is Keyan's flagship range for high-volume production. It handles PCB widths of 50~600mm and supports infrared/hot-air preheating, meeting high-throughput, high-reliability through-hole soldering needs from small batches to mass production. The series comprises BP350, BP450 and BP600 models, with supported PCB widths increasing from 50~350mm to 50~600mm. Customers can select the model that best matches their board dimensions and capacity requirements. The upgraded 4-stage preheating system provides more thorough, uniform heating, accommodates differences in thermal mass between large and multilayer PCBs, and maintains consistent soldering temperature profiles. Solder pot capacity is significantly increased: approximately 380kg for BP350, 450kg for BP450 and 700kg for BP600. The larger pots accommodate wider PCBs and more through-hole components. Wave pump power is also upgraded: 1/4 HPX2 3P 220VAC for BP350 and 1/2 HPX2 3P 220VAC for BP450/BP600. The stronger, more stable waves support through-hole fill and solder joint quality on large PCBs. The conveyor uses single-hook/double-hook titanium fingers as standard, with heavy-duty double-hook fingers available as an option for heavy PCBs. All models use WIN10+industrial PC+PLC, supporting one-touch recall of process parameters, efficient changeovers and full-process data traceability. Weighing 800kg to 1000kg, the robust machines are designed for continuous 24-hour mass production. Typical applications include through-hole soldering for large, high-power products such as new energy vehicle power management units, industrial variable-frequency drives, large power supplies, communications cabinet power supplies and LED display power supplies.

ENGINEERING DATA

Technical specifications

KEYAN-Y600BP

Model KEYAN-Y600BP
Model KEYAN-Y600BP
Application Wave soldering
KEYAN-Y600BP Technical specifications
Item Value
Machine dimensions 4500*1700*1650mm
Power supply AC380V, 50/60Hz, 3P5W, 60A
Nozzle Patented clog-free nozzle/ST-6 spray
Operating power 11kW
Control system WIN10+industrial PC+PLC
Preheating temperature control accuracy ±5°C
Needle valve pressure 0.2MPa~0.5MPa
Spray mode Pneumatic full-board spraying (standard); pneumatic selective spraying
Flux flow rate 10~100mL/min
Flux nozzle ST-6 lumina atomizing nozzle
Preheating method Infrared/hot-air heating
Number of preheating zones 4
Preheating temperature range Room temperature~230°C
Temperature control mode PID+SSR
Solder pot material 316 stainless steel+cast iron+titanium
Solder pot capacity (solder specific gravity 7.5) 700kg
Maximum allowable solder pot temperature Max. 300°C
Wave pump power 1/2 HPX1 220VAC
Wave height adjustment Stepless variable-frequency speed control
Wave height 0~15mm (standard); 15~20mm (optional)
PCB conveyor entry height 750±20mm
PCB width range 50~600mm
PCB component clearance Above board 120mm/below board 25mm
PCB conveyor speed 0~1800mm/min
Conveyor fingers Single-hook/double-hook titanium fingers (standard); heavy-duty double-hook titanium fingers (optional)
Speed control method Closed-loop stepless variable-frequency speed control
Cooling method Forced-air cooling
Weight 1000kg
Required exhaust flow 15m³/min ×2 channels; exhaust outlet diameter: Φ200mm; cooling
APPLICATION CONTEXT

Applications

Handles PCB widths of 50~600mm with infrared/hot-air preheating; high-throughput, high-reliability through-hole soldering from small batches to mass production; flexible capacity for wide PCBs; efficient, uniform multi-stage preheating; stable, reliable industrial-grade soldering configuration; intelligent, easy-to-use control of the entire process
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