KEYAN-Y300BP

The KEYAN-Y series BP wave soldering machines with three-stage preheating are an upgrade of the BE models. They retain the core advantages of the BE models while upgrading preheating to three stages and the control system from touch screen+PLC to WIN10+industrial PC+PLC, substantially improving automation and process control. Combined infrared/hot-air heating produces smoother, more precise preheating temperature profiles to accommodate complex PCBs and different components, reduce soldering defects and improve yield. The BP models combine powerful, uniform three-stage preheating with precise PID+SSR temperature control. The preheating range is room temperature~230°C, with an accuracy of ±5°C. The soldering system remains the same as the BE models: a patented clog-free nozzle/ST-6 nozzle, ST-6 lumina atomizing nozzle, adjustable flux flow of 10~100mL/min and needle valve pressure of 0.2MPa~0.5MPa, with pneumatic full-board spraying as standard and selective spraying as an option. The solder pot is also made of 316 stainless steel+cast iron+titanium, with a capacity of 150kg~280kg and a maximum allowable temperature of 300°C. Wave height is adjusted by stepless variable-frequency speed control, with 0~15mm as standard and 15~20mm as an option. The conveyor uses single-hook/double-hook titanium fingers as standard, with heavy-duty double-hook fingers available as an option. The PCB width range is 50~300mm, with component clearance of 120mm above and 25mm below the board. The core BP upgrade is its intelligent WIN10+industrial PC+PLC system, which stores and recalls process parameters, enables efficient changeovers and provides full-process data traceability for digital factory management. Typical applications include medium-volume through-hole soldering for automotive electronic modules, industrial control equipment, power supplies and communications equipment, especially where soldering quality and process control requirements are demanding.