KEYAN-K12

High-performance SMT equipment

Solder paste printers

KEYAN-K12

An efficient partner for large PCBs, supporting advanced technology applications

Designed for high-density, large PCBs used in high-end communications equipment and server motherboards; ±0.01mm precision and efficient performance support advanced technology applications; vision alignment repeatability of ±0.01mm and printing repeatability of ±0.025mm; printing cycle time ＜25sec/P for precise large-board printing; maximum PCB size of 1200×400mm, among the industry leaders

The KEYAN-K12 is Keyan's dedicated large-format solder paste printer for high-density, large PCBs used in high-end communications equipment and server motherboards. Supporting PCB sizes up to 1200×400mm, the K12 is one of the few printers in the industry capable of handling oversized backplanes. It matches the K8's vision alignment repeatability of ±0.01mm and printing repeatability of ±0.025mm, maintaining print consistency across the entire large board. This is critical for high-density interconnect products such as server motherboards and communications backplanes. The machine provides a printing stroke of up to 1200mm and fine squeegee pressure adjustment over 1~10kg. It accepts large stencil frames from 680×355mm to 1480×680mm. The PCB support system uses automatically controlled flexible clamping and support, with optional vacuum board holding to prevent large, thin boards from deforming or lifting during printing. Overall dimensions are L=2200*W=1200*H=1500mm and weight is 2000kg. A reinforced steel structure maintains stability during long-stroke printing. The K12 also offers optional adhesive dispensing, automatic solder paste replenishment, remaining solder paste detection and 3D solder paste inspection (SPI) to support the complete process requirements of high-end manufacturing. Typical applications include SMT production lines for large, highly reliable PCBs such as communications base station boards, server motherboards, data center switch backplanes and new energy vehicle controllers.

Model KEYAN-K12

Application Solder paste printers

KEYAN-K12 Technical specifications
Item	Value
Vision alignment repeatability	±0.01mm
Printing repeatability	±0.025mm
Printing cycle time	＜25sec/P (excluding stencil printing time)
Stencil separation	0~125mm/5
Printing mode	Single/double squeegee printing (electric drive)
Squeegee pressure	1~10kg
Standard squeegee angles	45°/55°/60°
Printing speed	10~200mm/sec
Printing stroke	50~1200mm
Stencil frame dimensions	680mm355mm~1480mm680mm
Cleaning method	Dry, wet
Vision system	High-frame-rate CCD image-processing camera
Fiducial recognition	Circular, square, diamond-shaped, text, pads and irregular shapes
Image acquisition mode	Single/dual imaging, error-proofing (camera can be fully disabled)
Inspection functions	2D vision inspection
System functions	Core inline connectivity
Maximum PCB size	1200*400mm
Minimum PCB size	100*65mm
PCB thickness	0.4~6mm
Maximum board weight	10kg
Conveyor height	900±40mm
Conveyor speed	1200mm/sec（MAX）
Machine dimensions	L=2200W=1200H=1500mm
Weight	2000kg
Power supply	AC 220V 50/60Hz single phase 2kW
Changeover time	＜5min
Optional functions	Adhesive dispensing, automatic solder paste replenishment, remaining solder paste detection, 3D solder paste inspection (SPI)